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LT3475/LT3475-1
PACKAGE DESCRIPTION
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CB
6.40 – 6.60*
6.60 ± 0.10
3.86
(.152)
2.74
(.252 – .260)
3.86
(.152)
20 1918 17 16 15 14 13 12 11
4.50 ± 0.10
SEE NOTE 4
(.108)
0.45 ± 0.05
2.74
(.108)
6.40
(.252)
BSC
1.05 ± 0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7 8 9 10
1.20
4.30 – 4.50*
(.169 – .177)
0.25
REF
0 ° – 8 °
(.047)
MAX
0.65
0.09 – 0.20
0.50 – 0.75
(.0256)
0.05 – 0.15
(.0035 – .0079)
(.020 – .030)
BSC
0.195 – 0.30
(.0077 – .0118)
(.002 – .006)
FE20 (CB) TSSOP 0204
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
2. DIMENSIONS ARE IN
MILLIMETERS
(INCHES)
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
3. DRAWING NOT TO SCALE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3475fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
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